Head gimbal assembly and magnetic disk drive with specific solder ball or slider pad and electrode stud dimensioning to produce reliable solder ball connection using laser energy

ABSTRACT

Embodiments of the invention provide a head gimbal assembly (HGA) capable of effecting solder ball connection with use of low energy. In one embodiment, the HGA includes a head/slider. In the head/slider, slider pads and lead wire pads are connected to each other by reflow of solder balls under the radiation of a laser beam. Lead layers are connected to a magnetic head and electrode studs are connected to the lead layers, respectively, and are also connected to the slider pads. The diameter R (m) of a solder ball and a sectional area S (m 2 ) of an electrode stud are in a relation of R 2 ≧4S.

BACKGROUND OF THE INVENTION

The present invention relates to a head/slider structure adapted toconnect slider pads and lead pads through solder balls and moreparticularly to a head/slider structure suitable for solder ballconnection with high-quality by radiation of weaker laser energy.

Recently, magnetic disk drives have come to be used in many electronicdevices and the necessity of improving yield in mass production isbecoming more and more important. A head gimbal assembly (hereinafterreferred to as “HGA”) which supports a slider formed with a magnetichead for data read and write is incorporated in a magnetic disk drive.The HGA comprises a head/slider including a magnetic head and a slider,a flexure constructed so as to permit the head/slider to perform a trackfollow-up motion while flying over the magnetic head and performingpivotal motions, a load beam which applies a pushing load to theflexure, a mounting plate adaptable to fix the load beam to an actuatorassembly, and a lead wire for electric connection between the magnetichead and a circuit board. The construction of the HGA exclusive of thehead/slider is designated a suspension assembly.

A slider pad which functions as a relay terminal for connecting themagnetic head to a lead pad formed at an end of the lead wire is formedon an outer side face of the slider. After fabrication of the suspensionassembly, the head/slider is fixed to a flexure tongue of the flexurewith use of an adhesive. Therefore, it is necessary that the lead padand the slider pad be connected together electrically after thehead/slider is fixed to the flexure tongue.

Soldered surfaces of the lead pad and the slider pad are disposed in apositional relation such that planes including the soldered surfacesintersect perpendicularly to each other (a virtual right angle is formedat an intersecting point when the soldered surfaces of both pads areviewed sideways). FIG. 10 is a diagram illustrating a state where a leadpad and a slider pad are connected together by a solder ball connectingmethod. In FIG. 10(A) there are shown metallic layers 219 a and 219 bwhich constitute a support structure of a flexure, dielectric layers 217a and 217 b of polyimide laminated onto the metallic layers 219 a and219 b, and a lead wire 221 formed by laminating a copper layer onto thedielectric layer 217 b. A head/slider 211 is mounted on the dielectriclayer 217 a in such a manner that an air bearing surface (hereinafter,referred to as “ABS”) 223 thereof opposed to a magnetic disk facesupward. A magnetic head is embedded into the head/slider 211 so that itcan be magnetically coupled with the magnetic disk opposed to the ABS223. Further, a slider pad 213 for connection between the magnetic headand the lead wire 221 is formed on an end side face of the head/slider211.

The metallic layer 219 a which supports the head/slider 211 is called aflexure tongue and, when the head/slider 211 flies over the surface ofthe magnetic disk, the metallic layer 219 a performs gimbal motions orpivot motions about a dimple which is formed as fulcrum on a load beam(not shown). The lead wire 221 extends toward the front face of theslider pad 213 up to a position such that there remains a space 225between the position and the head/slider 211. The lead wire 221 isformed with a lead pad 229 at its distal end.

According to the solder ball connecting method, first a spherical solderball 215 is temporarily fixed so as to come into contact with both theslider pad 213 and lead pad 229 and a laser beam is radiated to thesolder ball 215 in the direction of arrow A to melt the solder ball 215.Thereafter, the radiation of the laser beam is stopped, followed bycooling, to form a solder fillet 227 shown in FIG. 10(B) for electricconnection between the pads. In the solder ball connecting method, atthe time of reflowing the solder ball 215 with use of laser energy,there sometimes occurs a connection defect such as molten solder beingattracted strongly to one pad, resulting in the solder fillet 227 beingnot connected to the other pad, or the area of connection between thesolder fillet 227 and the pads being insufficient, or the strength ofconnection being insufficient, or the occurrence of short-circuit withan adjacent pad. The solder ball reflowing process using a laser beamincludes a process of performing both heating and cooling in anextremely short time as is described in Japanese Patent Laid-open No.10-79105.

BRIEF SUMMARY OF THE INVENTION

Recently, as one means for environmental conservation, lead-free solderhas come to be used as the material of a solder ball. The lead-freesolder is high in melting point. For example, the melting point oflead-free solder comprising Sn(85-95 wt %)/Ag(1-3 wt %)/Bi(1-5 wt%)/Cu(1 wt % or less) is as high as 210° C. to 216° C. in comparisonwith the melting point (184° C.) of commonly-used tin-lead eutecticsolder. Therefore, when a solder ball formed of lead-free solder isadopted in the solder ball connecting method, it is necessary that theradiation energy of a laser beam be made stronger than in the case ofusing tin-lead eutectic solder to increase the temperature of the solderball above the melting point.

However, if the laser beam radiation energy is made strong, thepolyimide layer present around the solder ball-connected slider pad andlead pad and the material of the magnetic head in the interior of theslider are liable to be damaged with heat. Thus, an upper-limit value isencountered in the magnitude of the radiation energy. If the radiationenergy to the solder ball is weakened, a connection defect may occur inthe solder fillet formed after cooling even if the solder ball is meltedand thus a lower-limit value is also encountered in the magnitude of theradiation energy.

Therefore, it is preferable that the solder ball connection be effectedusing radiation energy which is as weak as possible within the range ofnot causing a connection defect of the solder fillet. Methods forweakening the radiation energy includes a method for improving thematerial of solder, and a method wherein the structure of thehead/slider is modified so that the radiated laser energy can beutilized effectively for increasing the temperature of the solder ball.

Accordingly, it is a feature of the present invention to provide an HGAhaving a head/slider suitable for solder ball connection of good qualitywith use of a lowered magnitude of laser energy. It is another featureof the present invention to provide an HGA having a head/slider suitablefor solder ball connection with use of a solder ball formed of lead-freesolder. It is a further feature of the present invention to provide amagnetic disk drive which adopts such a head gimbal assembly.

According to embodiments of the present invention, at the time ofconnecting a slider pad of a head/slider and a lead pad by the solderball connecting method, the solder connection can be effected by theradiation of lower laser energy and provide a higher non-defect rate oryield. The solder ball connecting method indicates a method involvingradiating laser energy to a spherical solder, causing reflow and therebyallowing a solder fillet to be formed to connect a slider pad and a leadpad. It is different from the method wherein heat is applied to aspherical solder with use of soldering iron to melt the solder forconnection. It is also different from such a method as disclosed in U.S.Pat. No. 6,330,132 (Japanese Patent Laid-open No. 2000-251217) whereinultrasonic oscillation is applied to a ball-like bonding member formedof gold to effect connection.

In the solder ball connecting method, in order to form a solder filletof good quality, it is necessary that laser energy be radiated to asolder ball for a short time to melt the solder ball and the thus-meltedsolder be allowed to spread appropriately over connection surfaces ofthe slider pad and the lead pad. When the solder which has been in spotcontact with the slider pad in the state of a solder ball is melted andspreads over the surface of the slider pad, heat begins to be releasedfrom the slider pad and further through an electric current path formedin the interior of the slider. If the amount of the heat thus releasedis very large, the solder may be solidified before fully spreading overthe connection surface of the slider pad or a satisfactory electricconnection may not be attained between the solder and the connectionsurface.

The diameter R of the solder ball defines the volume of solder, which inturn defines the quantity of heat which molten solder possesses.Therefore, when the quantity of heat escaping to the electric currentpath through the slider pad is considered constant, the smaller thesolder ball diameter, the more conspicuous the decrease in temperatureof molten solder and the higher the defect rate in solder connection.Since the larger the sectional area of the electric current path, thelarger the amount of heat released via the slider pad, it is necessary,in order to keep a low defect rate in solder connection, that thesmaller the solder ball diameter, the smaller should be the sectionalarea of the electric current path. The head gimbal assembly according toan embodiment of the present invention is constructed so that the solderball diameter R (m) and a sectional area S (m²) of a connecting portionof the electric current path for connection to the slider pad, theelectric current path providing connection between the slider pad and amagnetic head, satisfies the relation of R²≧4S.

Moreover, the weaker the laser energy, the more conspicuous the decreasein temperature of solder, so by satisfying the above relation betweenthe solder ball diameter R and the sectional area S of the connection ofthe electric current path to the slider pad, it is possible to effectsolder connection of good quality with use of weak laser energy.

Further, the solder ball diameter is selected so as to be approximatelyequal to or a slightly smaller than the area A of the soldered surfaceof the slider pad. Therefore, it is possible to effect solder connectionof good quality by satisfying the relation of A≧4S between the area A(m²) of the soldered surface of the slider pad and the sectional area S(m²) of the connecting portion of the electric current path forconnection to the slider pad.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing the construction of a magnetic disk drive.

FIG. 2 is a perspective view showing the entire construction of a headgimbal assembly.

FIG. 3 is a partially enlarged perspective view of a head/slider portionin the head gimbal assembly.

FIG. 4 is a diagram showing a solder ball bonding apparatus wherein alaser beam is applied to a solder ball disposed between both pads toconnect both pads according to an embodiment of the present invention.

FIG. 5 is a diagram showing on a larger scale a state in which a solderball is placed on the head gimbal assembly held by a working jigaccording to an embodiment of the present invention.

FIG. 6 is a diagram showing on a larger scale a state in which a solderfillet is formed by melting of the solder ball and a slider pad and alead pad are thereby connected together according to an embodiment ofthe present invention.

FIG. 7 is an exploded perspective view showing a principal portion ofthe head/slider.

FIG. 8 is a sectional view of main constituent elements of thehead/slider as cut along a plane passing through the constituentelements and as viewed sideways.

FIG. 9 is a diagram explaining the size of each slider pad and that ofeach electrode stud in the head/slider.

FIG. 10 is a diagram explaining a conventional solder ball connectingmethod for connecting a slider pad and a lead pad in the head/slider.

FIG. 11 is a diagram showing a non-defective solder fillet rate asmeasured for each of various sectional sizes of electrode studs relativeto the solder ball diameter.

DETAILED DESCRIPTION OF THE INVENTION

A head/slider, an HGA and a magnetic disk drive according to specificembodiments of the present invention will be described below withreference to the drawings. FIG. 1 is a plan view showing theconstruction of a magnetic disk drive, FIG. 2 is a perspective viewshowing an entire construction of an HGA, and FIG. 3 is a partialenlarged view of a head/slider portion of the HGA shown in FIG. 2.Throughout the whole of the drawings in the present application, thesame constituent elements are identified by the same reference numerals.

As shown in FIG. 1, a magnetic disk drive 10 is provided on a base 2with a magnetic disk 3, a head stack assembly 4, a flexible cable 5, anda terminal 6 for connecting the flexible cable 5 to an external circuitboard. The magnetic disk 3 is screwed to a rotor portion of a spindlemotor (not shown) which is disposed in the base 2 and is constructed soas to rotate about a spindle shaft 7.

The head stack assembly 4 is composed of an HGA 41 and an actuatorassembly 42. As shown, for example, in FIG. 2, the HGA 41 is constructedas a wiring-integrated type suspension and a principal portion thereofis made up of a head/slider 52, a base plate 43, a load beam 44, a hinge45, and a flexure 46. The base plate 43 is formed with an aperture 43 a.By utilizing the aperture 43 a, a mounting plate fixed to the back sideof the base plate 43 is subjected to swaging to fix the HGA 41 to theactuator assembly 42. The structure which remains after removing thehead/slider from the HGA 41 is designated a suspension assembly.

As wiring integrated type suspensions there are known a subtractive typeand an FPC type in addition to an additive type according to thisembodiment depending on the difference in their fabrication methods.However, the present invention is applicable to any type of thesuspension assembly. The additive type is a method wherein copper foilwiring and pads are additionally formed onto an insulator of asuspension. The subtractive type is a method wherein wiring and pads areformed by etching copper foil which is formed like sheet on an insulatorof a suspension. The FPC type is a method wherein a flexible substrate(FPC) formed with copper foil wiring and pads is bonded to a suspension.

The actuator assembly 42 is made up of an actuator arm (not shown) whichsupports the HGA 41, a fixing portion for a pivot assembly whichconstitutes a pivot shaft 8, and a coil support (not shown) which holdsa voice coil (not shown). The actuator assembly 42 pivotally moves theHGA 41 in the direction of arrow A or B about the pivot shaft 8. Thevoice coil and a yoke 9, together with a voice coil magnet (not shown),constitutes a voice coil motor (hereinafter referred to as “VCM”).

The hinge 45, which has elasticity, connects the base plate 43 with theload beam 44 and imparts a pushing load to the load beam 44 so that thehead/slider can fly over the magnetic disk properly. A lift tab 47 isformed at a front end of the HGA 41 in order to implement a load/unloadsystem together with a ramp. A lead wire 49 extends in a crank shapefrom the front end of the HGA 41 to a connector portion 48. The flexure46 holds the lead wire 49 on the front end side thereof and isspot-welded to the load beam 44 and the base plate 44 by means of alaser. The lead wire 49 includes four conductors connected to a magnetichead formed in the head/slider 52. The number of such conductors variesdepending on the construction of the magnetic head.

The flexure 46 is fixed to the load beam 44 so that a flexure tongue 51with the head/slider 52 fixed thereto can perform pivot motions orgimbal motions. As shown in FIG. 3, the flexure tongue 51 is formed soas to project from a platform 50 located at a foremost end of theflexure 46 toward the center of the aperture and a fixing surface of thehead/slider 52 is fixed, with the ABS 52 b up, to the flexure tongue 51with an adhesive.

A dimple (not shown) projects from the load beam 44 and it supports theflexure tongue 51 at a position corresponding to the central part of theslider 52. According to this structure, when the head/slider 52 fliesunder the action of an air flow created on the surface of the magneticdisk, it performs soft pivot motions in both pitch and roll directionsrelative to the load beam 44 and thus can perform a track follow-upmotion.

An aperture 54 is formed in the portion where slider pads 55 a, 55 b, 55c, 55 d are solder-connect to lead pads 56 a, 56 a, 56 c, 56 d,respectively, that is, between the platform 50 and the flexure tongue51. As shown in FIG. 3, at or near a position where the lead wire 49outgoes from a protective sheet the lead wire 49 shown in FIG. 2 isdivided into two pairs of lead wires 53. The lead wires 53 extend towardthe front end of the HGA 41, then at a side face of the aperture 54formed in the front end portion of the flexure 46 the lead wires 53 bendat approximately right angles in a floating state in the air and reachthe platform 50. Further, on the platform 50, each of the lead wires 53again bends approximately perpendicularly toward the corresponding oneof the slider pads 55 a, 55 b, 55 c and 55 d formed on a side face 52 aof the head/slider 52 which side face is located on an air flow outletend side, i.e., on a trailing edge side.

The four slider pads 55 a, 55 b, 55 c and 55 d are appropriatelyconnected to a write head and a read head both formed in the interior ofthe head/slider 52. The number of slider pads is not limited to four.Recently there also has been developed a head/slider of the type whereina flying height which varies due to thermal protrusion generated in awrite head is adjusted with a heater formed in the head/slider. In thiscase, a total of six slider pads are formed which include slider padsconnected to the heater in addition to slider pads connected to writeand read heads. Further, since the spacing between each slider padbecomes narrower, it is necessary that lead pads and slider pads besoldered together with a high degree of accuracy while ensuring goodquality even with use of low laser energy. In this point the head/sliderstructure of this embodiment is effective.

At ends of the bent lead wires 53 the lead pads 56 a, 56 b, 56 c and 56d are formed to connect with the slider pads 55 a, 55 b, 55 c and 55 d,respectively, formed on the side face 52 a on the trailing edge side ofthe head/slider 52. The slider pads 55 a, 55 b, 55 c and 55 d are formedby plating a seed layer with gold, the seed layer being formed of, forexample, nickel or chromium on the surface of the slider 52. A planeextending from the surface or soldering surface of each slider pad and aplane extending from the surface or a soldering surface of each lead padintersect each other at right angles. In the present invention, however,it is not necessary to make limitation to the case where planesextending from the surfaces of the slider pads 55 a, 55 b, 55 c, 55 dand the lead pads 56 a, 56 b, 56 c, 56 d intersect each other at rightangles. The present invention is also applicable to the case where theplanes intersect each other at another angle selected suitably for thesolder ball connection.

The following description is now provided of the method of connectingthe slider pads 55 a, 55 b, 55 c, 55 d and the lead pads 56 a, 56 b, 56c, 56 d, respectively, by the solder ball connecting method. First, theHSA 41 is supported by a jig so that the right angle defined by theplane extending from the surface of each slider pad and the planeextending from the surface of each lead pad faces vertically upward.Then solder balls are placed temporarily between both pads, andthereafter a laser beam is applied to each solder ball to form a solderfillet which bridges between both pads, thus connecting both the pads.

A description will now be given of a method for supporting the HGA 41 sothat the right-angled portion defined by the surface of each slider padand the surface of each lead pad faces upward. FIG. 4 is a sectionalview of a solder ball bonding apparatus which applies a laser beam to asolder ball 70 disposed between both pads to connect the pads. FIG. 5 isa sectional view showing on a larger scale a state in which the solderball 70 is placed temporarily on the HGA 41 held by a working jig 11shown in FIG. 4. An optical (laser) device 13 for applying a laser beam80 to the solder ball 70, the working jig 11 which holds the HGA 41, anda table 12 which holds the working jig 11, are shown in FIG. 4.

The table 12 has a mount surface 12 a having an inclination of 45°relative to a horizontal plane H, and the working jig 11 is placed onthe slant surface 12 a so as to also have an inclination of 45° relativeto the horizontal plane H. Further, the HGA 41 is held on the workingjig 11 in a state where the head/slider 52 assumes an upper position andits ABS faces upward. At this time, in the HGA 41 held by the workingjig 11, the surfaces of the slider pads 55 a, 55 b, 55 c, 55 d on thefront end portion of the HGA 41 and the surfaces of the lead pads 56 a,56 b, 56 c, 56 d opposed thereto respectively are maintained at an angleof approximately 45° relative to the horizontal plane. Thus, the HGA 41is supported in such a manner that the V structure of a virtualright-angled portion formed by the surfaces of the slider pads 55 a, 55b, 55 c, 55 d and the surfaces of the lead pads 56 a, 56 b, 56 c, 56 dis open vertically upward.

Then, the solder ball 70 is temporarily placed between each of theslider pads and each of the lead pads and thereafter the laser beam 80is directed to the solder ball 70. The method of disposing the solderball 70 between both pads and applying the laser beam 80 to the solderball is described in detail in Japanese Patent Laid-open Nos. 2002-25025and 2002-251705, the disclosures of which are incorporated herein byreference. The method for disposing the solder ball 70 and theconstruction of the optical device 13 are simply explained because theyare not directly related to the present invention.

The optical device 13 is a terminal module of a fiber laser whichutilizes an optical fiber as a resonator. It has a series of opticallenses arranged on an internal optical path to form a hollow space as alaser beam path. The optical lenses converge divergent rays outputtedfrom an optical fiber into the laser beam 80, and the convergent raysare outputted from a front end of the optical device 13.

The slider pads 55 a, 55 b, 55 c, 55 d and the lead pads 56 a, 56 b, 56c, 56 d are arranged so as to rise at an angle of 45° from thehorizontal plane. The planes extending from the surfaces of the sliderpads 55 a, 55 b, 55 c, 55 d and from the surfaces of the lead pads 56 a,56 b, 56 c, 56 d intersect each other, with a virtual right angle beingformed between both pads. Since the virtual angle is open verticallyupward, the solder ball 70 which is dropped from a solder ball transferdevice can be received.

When the solder ball 70 is placed so as to contact the connectingsurfaces of the associated slider pad and lead pad and becomesstandstill, the optical device 13 is moved to an irradiating position bya moving mechanism (not shown) and emits a converged laser beam 80 witha predetermined spot diameter to the solder ball 70. At a timing duringthe period from the temporary placing of the solder ball 70 to theemission of the laser beam 80, a predetermined amount of nitrogen gas(N₂) which creates an inert atmosphere for suppressing the oxidation ofsolder is injected through a nitrogen gas introducing pipe installed inthe table 12. Thus, the slider pads 55 a, 55 b, 55 c, 55 d, the leadpads 56 a, 56 b, 56 c, 56 d and solder balls 70 are placed in an inertatmosphere.

While the inert atmosphere is maintained, the optical device 13 directsthe laser beam 80 to the solder balls 70 to melt them, therebyconnecting the slider pads 55 a, 55 b, 55 c, 55 d with the lead pads 56a, 56 b, 56 c, 56 d, respectively. For example, in a case of the outsidediameter of each solder ball 70 being about 120 μm, the spot diameter ofthe laser beam 80 is set at a value of about 150 to 200 μm, so that aportion of the laser beam is directed to a place other than the solderball. A solder ball 70 having an outside diameter of about 130 μm orless can be used. For example a solder ball 70 having an outsidediameter of about 80 μm, 110 μm, or 130 μm is used.

Thus, by melting solder in an inert atmosphere of nitrogen gas (N₂),both pads are bonded together, followed by cooling to form a solderfillet. At this time, the inert nitrogen gas (N₂) covers the surface ofthe solder, whereby the oxidation of the solder can be prevented. FIG. 6is a sectional view showing on a larger scale a mutually connected stateof both slider pad 55 and lead pad 56 by melting of the solder ballshown in FIG. 5.

The molten solder ball 70 spreads throughout the whole surfaces of boththe slider pad 55 and lead pad 6. When the radiation of the laser beamis subsequently stopped, the solder is cooled and solidifies to form asolder fillet 71 which connects both pads in an inverted arch shape.When the solder melted by the radiation of the laser beam comes intocontact with the soldering surface of the slider pad and spreads overthe same surface, if the drop of the solder temperature is excessive,the molten solder may fail to spread throughout the whole surface of theslider pad, or the solder quantity may be biased to the lead pad side,or a connection defect between the soldering surface and the solderfillet may occur, thus making it impossible to form a solder fillet ofgood quality.

FIG. 7 is a perspective view for schematically explaining the structureof the slider pads of the head/slider 52 and the magnetic head portion.FIG. 8 is a sectional view of main constituent elements of thehead/slider 52 as cut along a plane perpendicular to ABS 52 b and a bodyend face 52 e and as seen sideways. The profile of the head/slider 52 isformed by a body 52 d of a rectangular parallelepiped shape, the body 52d being formed using, for example, a sintered material of Al, Ti and Ccalled AlTic, and a protective film 52 f laminated to the body end face52 e as one face of the body 52 d.

The ABS 52 b is a surface which undergoes a lifting force from an airflow in opposition to the surface of the magnetic disk when thehead/slider 52 is installed within the magnetic disk drive 10. A centerpad 52 c and various other profile pattern shapes are formed by etchingthe AlTic. On the body end face 52 e which is orthogonal to the ABS 52b, a read head and a write head both constituting a magnetic head 58 areformed using a thin film process at the portion corresponding to thecenter pad 52 c and in the vicinity thereof.

The thin film magnetic head 58 formed on the head/slider 52 isconstituted as a composite magnetic head. The composite magnetic headcomprises a read head portion for reading magnetic information recordedon the magnetic disk 3 and a write head portion for writing magneticinformation to the magnetic recording medium, the read head and thewrite head being integral with each other. For example, at a portionclose to the ABS 52 b in the region of the body 52 d, the read headportion has a sequentially laminated structure of an insulating layer121, a lower shield layer 119, a lower shield gap layer 115, an uppershield gap layer 111, and an upper shield layer 113. The upper shieldlayer 113 also functions as a lower magnetic pole of the write headportion. The upper shield layer 113 may be formed in a shape such thatan upper shield layer is separated from the lower magnetic pole.

An MR element 117 comprising a giant magnetoresistive effect film (GMRfilm) and a magnetic domain control film is formed between the uppershield gap layer 111 and the lower shield gap layer 115. The MR element117 is for reading information recorded on the magnetic disk 3 and it isdisposed in face of the ABS 52 b. The MR element 117 may also beconstituted as a magnetoresistive effect element (MR film).

The magnetic domain control film, which is formed on both sides of theGMR film, is for applying a bias magnetic field in a constant directionto the GMR film. A pair of lead layers 105 c and 105 d are connected tothe MR element 117. Like the MR element 117, the lead layers 105 c and105 d are formed between the lower shield gap layer 115 and the uppershield gap layer 111. The lead layers 105 c and 105 d are formed ofmetal such as, for example, tantalum (Ta).

The lead layers 105 c and 105 d extend through the upper shield gaplayer 111 and are connected to inner pads 103 c and 103 d formed on theupper shield gap layer 111. The write head portion comprises an uppermagnetic pole 109, the upper shield layer 113 and a coil 107. The uppermagnetic pole 109 and the upper shield layer 113 are magneticallycoupled together at the central part of the coil 107 and their portionsfacing the ABS 52 b form a write gap as a magnetic path. A magnetic fluxcreated by an electric current flowing in the coil 107 which extendsthrough the interior passes through the magnetic path. A lead layer 105a is connected to an end portion lying on the central side of the coil107, while a lead layer 105 b is connected to an outside end portion ofthe coil.

The lead layers 105 a and 105 b are connected respectively to inner pads103 a and 103 b formed on the upper shield gap layer 111. The inner padsare copper layers formed by sputtering or CVD. Pillar-shaped electrodestuds 101 a, 101 b, 101 c, and 101 d, each having a square sectionperpendicular to the current passing direction, are connected to theinner pads 103 a, 103 b, 103 c, and 103 d, respectively. The electrodestuds, each having a length of X, are formed by a known method such ascopper plating. The slider pads 55 a, 55 b, 55 c, and 55 d, areconnected to the electrode studs 101 a, 101 b, 101 c, and 101 d,respectively.

The magnetic head 58 formed with the body end face 52 e, the lead layers105 a, 105 b, 105 c, 105 d, the inner pads 103 a, 103 b, 103 c, 103 d,and the electrode studs 101 a, 101 b, 101 c, 101 d, are covered with theprotective film 52 f of aluminum oxide. The slider pads 55 a, 55 b, 55 cand 55 d are formed on the trailing edge side face 52 a as the surfaceof the protective film 52 f. The electrode studs, the inner pads and thelead layers constitute electric current paths from the slider pads tothe magnetic head. In the electric current paths, the portions connecteddirectly to the slider pads are formed in a process separate from theprocess for forming the lead layers 105 a, 105 b, 105 c and 105 d. Thus,it is impossible to connect the lead layers directly to the slider pads55 a, 55 b, 55 c and 55 d. The electrode studs 101 a, 101 b, 101 c and101 d are provided for this reason.

The slider pads are connected to the lead pads by the solder ballconnecting method. When a recording current is passed through the sliderpads 55 a and 55 b in a write operation, a magnetic flux is createdbetween the upper shield layer 113 as the lower magnetic pole and theupper magnetic pole 109 and a signal magnetic field for write is inducedin the vicinity of a write gap. With this signal magnetic field, themagnetic disk is magnetized and information can be recorded thereby. Onthe other hand, in a read operation, a sense current is allowed to flowin the GMR film of the MR element 117 through the slider pads 55 c and55 d. The resistance value of the GMR film varies depending on thesignal magnetic field provided from the magnetic disk, so by detectingthe change of the resistance value as voltage it is possible to readinformation recorded on the magnetic disk.

FIG. 9 illustrates a dimensional relation between the slider pads 55 a,55 b, 55 c, 55 d and the electrode studs 101 a, 101 b, 101 c, 101 d. Thesoldering surface of each slider pad is formed in a rectangular shapehaving a width W of 138 μm and a height H of 145 μm and the area of thesoldering surface is 20,100 μm². A section of each electrode studperpendicular to the current flowing direction is formed in a squareshape each side of which is L (μm). The sectional shape of eachelectrode stud may be selected in an arbitrary manner, for example, fromamong square, rectangular and circular shapes. In the presentembodiment, the sectional area of each electrode stud is made smallerthan that in the conventional like electrode stud, whereby a solderfillet of good quality can be formed even with weak laser energy.

FIG. 11 is a graph showing a percent non-defective in solder connectionobtained when slider pads and lead pads are soldered to each other bythe solder ball connecting method under varying magnitudes of laserenergy with respect to electrode studs having sectional areas of varioussizes. The axis of abscissa in FIG. 11 represents the proportion of anactual laser energy magnitude relative to a laser energy magnitudeestablished as a reference. The percent non-defective in solderconnection plotted along the axis of ordinate was calculated byacceptance/unacceptance determination based on visual inspection ofsolder fillets after reflow performed for two hundred samples comprisingslider pad/lead pad pairs. The determination of a connection defect ismade when a solder fillet is not completely connected to the associatedslider pad and lead pad or when solder fillets are short-circuited witheach other or when the shape of a solder filler is not a normal shape.

The solder ball used in the experiment is formed using a lead-freesolder and the diameter R thereof is 130 μm. In FIG. 11, the line (a)indicates the result obtained by applying the solder ball connectingmethod to a head/slider having electrode studs of a sectional area ofsuch a size as heretofore been adopted. The value of L of each electrodestud is 90 μm. The percent non-defective in solder connection is onlyabout 95% even with an increase of the laser energy magnitude to 138%and it decreases with a decrease of the laser energy magnitude.Heretofore, to form electrode studs safely, the value of L has been setto such a relative large value as 90 μm, which value has been maintainedbecause there has been no need of making it smaller.

The line (b) in FIG. 11 indicates the result obtained by applying thesolder ball connecting method to a head/slider having electrode studs ofa sectional area of such a size as is adopted in the present embodiment.The value of L of each electrode stud is 75 μm. Throughout the whole ofthe laser energy magnitude used in the experiment the percentnon-defective in solder connection is improved in comparison with theline (a) adopting the conventional electrode studs. The lines (c) and(d) each indicate the result obtained by applying the solder ballconnecting method to a head/slider having electrode studs of a sectionalarea of such a size as is adopted in the present embodiment. The line(c) is of the case where L of each electrode stud is 57 μm and the line(d) is of the case where L of each electrode stud is 30 μm.

It is seen from FIG. 11 that when the same laser energy is radiated tosolder balls of the same diameter in accordance with the solder ballconnecting method, the smaller the sectional area of each electrodestud, the higher the percent non-defective in solder connection. Asshown in line (d), when L of each electrode stud is set at 30 μm, thepercent non-defective in solder connection can be made 100% even if thelaser energy is lowered to 88%. In connection with the solder ballconnecting method, an attempt to make the sectional area of an electrodestud small to thereby improve the percent non-defective in solderconnection has not been made yet and thus it is a novel finding in thepresent invention. This is presumed to be because of an excessive fearof a possible lowering in the reliability of connection with slider padsand inner pads in case of making small the sectional area of eachelectrode stud, with consequent failure to reach the idea in question.In the present invention, however, it has been confirmed that therearises no problem even if the value of L of each electrode stud is madeas small as 30 μm, provided the value of 30 μm is not the lower limit ofL.

The relation between the size of a sectional area of each electrode studand the percent non-defective in solder connection, which is shown inFIG. 11, is analyzed as follows. The reason why the percentnon-defective in solder connection lowers with a lowering of laserenergy is that heat is absorbed by each electrode stud with consequentdrop of temperature before the solder ball melted by the radiation of alaser beam spreads sufficiently over the connecting surfaces of bothslider pad and lead pad in accordance with the wettability of solder.Therefore, if it is assumed that the quantity of heat absorbed by eachelectrode stud is the same, the smaller the diameter R of a solder ball,the more marked the lowering in temperature of melted solder ball andthe lower the percent non-defective in solder connection.

The larger the sectional area of an electrode stud, the larger thequantity of heat which the electrode stud absorbs in a definite periodof time. Therefore it is possible to specify such a head/sliderstructure as permits improvement of the percent non-defective in solderconnection with the relation between the solder ball diameter R (m) andthe electrode stud sectional area S (m²) as a parameter. In the presentembodiment, the solder ball diameter R and the electrode stud sectionalarea S are selected so as to satisfy the relation of R²≧4S, whereby itis possible to effect such a solder connection as affords a high percentnon-defective in solder connection. This indicates that when the solderball diameter is set at 130 μm, the electrode stud sectional area Sbecomes 4,225 μm² and one side L of a square becomes 65 μm, thus theelectrode stud sectional area becomes smaller than the sectional area ofthe electrode stud having one side L of 90 μm adopted in theconventional head/slider.

In order to effect solder connection at a percent non-defective productscorresponding to the line (d) in FIG. 11, since the solder ball diameteris 130 μm and the electrode stud sectional area is 900 μm², it ispreferable to define the size of a solder ball and the sectional area ofan electrode stud so as to satisfy the relation of R²≧19S. A suitablelower limit of the sectional area S may be selected so as to make itpossible to ensure required current conduction capacity and connectionreliability. To attain the effect of the present embodiment it ispreferable that the sectional area S be as small as possible. Althoughthe relations of R²≧4S and R²≧19S are here derived from specific workingexamples, they can also be applied to other solder ball-electrode studcombinations on the basis of the principle of the present invention.

The solder ball diameter R determines the quantity of solder for forminga solder fillet. The size of a solder fillet is influenced by the sizesof corresponding slider pad and lead pad and the spacing between bothpads. In the solder ball connecting method, the solder ball diameter Ris selected so as to be almost equal to or a little smaller than oneside of a square slider pad. In view of this embodiment, the parameterincluding the solder ball diameter R and the electrode stud sectionalarea S can be replaced by a relation between the soldering surface areaA (m²) of a slider pad and the sectional area S (m²) of an electrodepad.

In this case, since R² corresponds to the soldering surface area A ofthe slider pad, R²≧4S can be replaced by A≧4S and R²≧19S can be replacedby A≧19S. Although the relations of A≧4S and A≧19S are derived fromspecific working examples, they can also be applied to other sliderpad-electrode stud combinations on the basis of the principle of thepresent invention and the general relation between the solder balldiameter and the slider pad size adopted in the solder ball connectingmethod.

When the electrode stud sectional area S is defined relative to thesolder ball diameter R or the soldering surface area A of a slider pad,it becomes possible to use weaker laser energy for the fabrication ofHGA having been subjected to the soldering process at a higher percentnon-defective in solder connection. Weakening the laser energy to acertain value is advantageous in that, in the fabrication of HGA, notonly actualized damage of magnetic head elements and dielectric materialcaused by laser energy can be diminished, but also latent damageincapable of being found out in the fabrication stage can be diminished.Further, assuming that the magnitude of laser energy is constant, it ispossible to fabricate HGA at a higher percent non-defective in solderconnection.

It is to be understood that the above description is intended to beillustrative and not restrictive. Many embodiments will be apparent tothose of skill in the art upon reviewing the above description. Thescope of the invention should, therefore, be determined not withreference to the above description, but instead should be determinedwith reference to the appended claims alone with their full scope ofequivalents.

1. A head gimbal assembly comprising: a suspension assembly including alead wire formed with a lead pad, a flexure and a load beam; and ahead/slider attached to said flexure and including a slider padconnected to said lead pad through a solder fillet formed on a solderball by emission of a laser beam, said head/slider further including: amagnetic head; and an electric current path connected to both saidmagnetic head and said slider pad, the electric current path including apillar-shaped electrode stud connected to said slider pad; wherein adiameter R (m) of said solder ball and a sectional area S (m²) of saidelectrode stud are in the relation of R²≧4S.
 2. A magnetic disk drivecomprising: a magnetic disk; a head gimbal assembly including ahead/slider and a suspension assembly with said head/slider mountedthereon, said head/slider having a magnetic head adapted to access saidmagnetic disk; and an actuator assembly with said head gimbal assemblyattached thereto; wherein said head gimbal assembly is the head gimbalassembly recited in claim
 1. 3. A head gimbal assembly according toclaim 1, wherein the diameter R (m) of said solder ball and thesectional area S (m²) of said electrode stud are in the relation ofR²≧19S.
 4. A head gimbal assembly according to claim 1, wherein thesection of said electrode stud is formed in a substantially square,rectangular or circular shape.
 5. A head gimbal assembly according toclaim 1, wherein said electric current path has an internal pad forconnection between a lead layer connected to said magnetic head and saidelectrode stud.
 6. A head gimbal assembly according to claim 1, whereinsaid electrode stud is formed within a protective film of aluminumoxide.
 7. A head gimbal assembly according to claim 1, wherein saidelectrode stud is formed of copper.
 8. A head gimbal assembly accordingto claim 1, wherein the diameter R of said solder ball is about 130 μmor less.
 9. A head gimbal assembly according to claim 1, wherein saidsolder ball is formed of lead-free solder.
 10. A head gimbal assemblyaccording to claim 1, wherein: said magnetic head includes a read headand an inductive write head; said head/slider includes four electriccurrent paths connected to said write head and said read head, and fourslider pads connected to said four electric current paths respectively;and the sectional area S (m²) of the connection between each of saidfour electric current paths and each of said slider pads and thediameter R (m) of said solder ball are in the relation of R²≧4S.
 11. Ahead gimbal assembly comprising: a suspension assembly including a leadwire formed with a lead pad, a flexure and a load beam; and ahead/slider attached to said flexure and including a slider padconnected to said lead pad through a solder fillet formed on a solderball by emission of a laser beam, said head/slider further including: amagnetic head; and an electric current path connected to both saidmagnetic head and said slider pad, the electric current path including apillar-shaped electrode stud connected to said slider pad; wherein anarea A (m²) of a soldered surface of the slider pad and a sectional areaS (m²) of said electrode stud are in the relation of A≧4S.
 12. A headgimbal assembly according to claim 11, wherein said solder ball isformed of lead-free solder.
 13. A head gimbal assembly according toclaim 11, wherein the area A (m²) of the soldered surface of said sliderpad and the sectional area S (m²) of said electrode stud are in therelation of A≧19S.
 14. A head gimbal assembly according to claim 11,wherein the section of said electrode stud is formed in a substantiallysquare, rectangular or circular shape.
 15. A head gimbal assemblyaccording to claim 11, wherein said electric current path has aninternal pad for connection between a lead layer connected to saidmagnetic head and said electrode stud.
 16. A head gimbal assemblyaccording to claim 11, wherein said electrode stud is formed within aprotective film of aluminum oxide.
 17. A head gimbal assembly accordingto claim 11, wherein said electrode stud is formed of copper.
 18. A headgimbal assembly according to claim 11, wherein the diameter R of saidsolder ball is in the range of about 80 to 130 μm.